HDI PCB ua nyob rau hauv ib tug automated PCB Hoobkas --- ENEPIG PCB nto tiav
ENEPIG (Electroless Nickel Electroless Palladium Immersion Kub) tsis yog siv PCB nto tiav tam sim no thaum tau dhau los ua neeg nyiam hauv PCB kev lag luam.Nws yog muaj feem xyuam rau ntau yam ntawm daim ntawv thov piv txwv li, varied nto pob khoom thiab siab heev PCB boards.ENEPIG yog qhov hloov kho tshiab ntawm ENIG, nrog rau qhov sib ntxiv ntawm Palladium txheej (0.1-0.5 µm / 4 txog 20 μ'') ntawm Nickel (3-6 µm / 120 - 240 μ'') thiab Kub (0,02- 0.05 µm / 1 mus rau 2 μ') los ntawm cov txheej txheem tshuaj immersion hauv PCB Hoobkas.Lub palladium ua haujlwm los tiv thaiv cov nickel txheej ntawm corrosion los ntawm Au, uas pab tiv thaiv "dub ncoo" los ntawm qhov tshwm sim uas yog ib qho teeb meem loj rau ENIG.
Yog tias tsis muaj kev sib koom ua ke ntawm cov peev nyiaj, ENEPIG zoo li qhov kev xaiv zoo dua rau feem ntau ntawm cov xwm txheej tshwj xeeb ntawm cov kev xav tau tshwj xeeb nrog ntau hom pob xws li, dhau-qhov, SMT, BGA, xaim sib txuas, thiab nias haum, thaum muab piv rau ENIG.
Ntxiv mus, Zoo heev durability thiab kuj ua rau nws ntev txee lub neej.Thin immersion coat ua rau qhov chaw tso thiab soldering yooj yim thiab txhim khu kev qha.Tsis tas li ntawd, ENEPIG muab qhov kev xaiv zoo tshaj plaws Hlau Bonding xaiv.
Pros:
• Yooj yim rau txheej txheem
• Dub Pad Dawb
• tiaj tus
• Lub neej txee zoo heev (12 lub hlis +)
• Tso cai rau ntau lub voj voog rov qab
• Zoo rau Plated Los Ntawm Qhov
• Zoo rau Fine Pitch / BGA / Cov Cheebtsam me
• Zoo rau Kov Sib cuag / Push Contact
• Kev ntseeg siab dua Hlau Bonding (kub / txhuas) dua li ENIG
• Muaj zog Solder Reliability dua ENIG;Cov ntaub ntawv txhim khu kev qha Ni/Sn solder pob qij txha
• Tau tshaj Sn-Ag-Cu solders
• Kev soj ntsuam yooj yim dua
Cons:
• Tsis yog txhua tus neeg tsim khoom tuaj yeem muab tau.
• Kev ntub dej kom ntev dua.
• Tus nqi siab dua
• Cov kev ua tau zoo yog cuam tshuam los ntawm cov txheej txheem plating
• Tej zaum yuav tsis muaj kev ntseeg siab rau kev sib txuas ntawm cov hlau kub thaum piv rau Soft Gold
Feem ntau siv:
High Density Assemblies, Complex lossis Mixed Package Technologies, High Performance Devices, Wire Bonding application, IC carrier PCBs, thiab lwm yam.
Rov qabrau Blogs
Post lub sij hawm: Feb-02-2023
