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Yuav ua li cas xaiv Surface Finish rau koj tus qauv PCB

Ⅱ Kev ntsuam xyuas thiab kev sib piv

Tshaj tawm: Nov 16, 2022

Pawg: Blogs

Tags: pcb ua,pcba ua,pcb sib,ua pcb, pcb nto tiav

Muaj ntau cov lus qhia txog kev ua kom tiav, xws li HASL tsis muaj txhuas muaj teeb meem kom muaj qhov sib xws.Electrolytic Ni/Au yog qhov kim heev thiab yog tias kub ntau dhau tso rau hauv ncoo, tuaj yeem ua rau cov pob qij txha tawg.Immersion tin muaj solderability degradation tom qab raug mus rau ntau lub tshav kub mus, xws li nyob rau hauv ib tug sab saum toj thiab hauv qab sab PCBA reflow txheej txheem, thiab lwm yam.. Qhov sib txawv ntawm saum npoo finishes yuav tsum tau kom meej meej paub.Cov lus hauv qab no qhia tau hais tias qhov kev ntsuam xyuas ntxhib rau qhov feem ntau siv ua tiav ntawm cov ntawv luam tawm Circuit Board.

Table1 Cov lus piav qhia luv luv ntawm cov txheej txheem tsim khoom, cov txiaj ntsig tseem ceeb thiab qhov tsis zoo, thiab cov ntawv thov raug nyiam ntawm cov hlau lead-dawb nto tiav ntawm PCB

PCB nto tiav

Txheej txheem

Thickness

Qhov zoo

Qhov tsis zoo

Tej kev siv

Lead-free HASL

PCB boards yog immersed nyob rau hauv ib tug molten tin da dej thiab ces tau tshuab los ntawm cov cua kub riam rau tiaj pats thiab tshaj solder tshem tawm.

30µin (1µm) -1500µin (40µm)

Zoo Solderability;Muaj dav;tuaj yeem kho / rov ua haujlwm dua;Txee ntev ntev

Qhov chaw tsis sib xws;Thermal shock;Kev ntub dej tsis zoo;Solder choj;Txuas PTHs.

Siv dav dav;Haum rau cov ntaub qhwv loj thiab qhov sib txawv;Tsis haum rau HDI nrog <20 mil (0.5mm) zoo suab thiab BGA;Tsis zoo rau PTH;Tsis haum rau tuab tooj liab PCB;Feem ntau, daim ntawv thov: Circuit Court boards rau kev kuaj hluav taws xob, tes soldering, qee cov khoom siv hluav taws xob zoo xws li aerospace thiab tub rog.

OSP

Kev siv tshuaj lom neeg cov khoom siv rau cov boards nto tsim cov organic metallic txheej los tiv thaiv cov tooj liab los ntawm xeb.

46µin (1.15µm) – 52µin (1.3µm)

Tus nqi qis;Pads yog sib xws thiab tiaj tus;Zoo solderability;tuaj yeem ua ke nrog lwm qhov chaw tiav;Txheej txheem yog yooj yim;tuaj yeem rov ua dua (hauv kev cob qhia).

rhiab heev rau kev tuav;Lub neej luv luv.Tsawg heev solder kis;Solderability degradation nrog siab temp & cycles;Nonconductive;Tsis yooj yim rau kev soj ntsuam, ICT sojntsuam, ionic & press-fit kev txhawj xeeb

Siv dav dav;Zoo haum rau SMT / nplua pitches / BGA / me me;Pab pawg thawj coj saib;Tsis zoo rau PTHs;Tsis haum rau crimping technology

ENIG

Cov txheej txheem tshuaj lom neeg uas ua rau cov tooj liab nthuav tawm nrog Nickel thiab Kub, yog li nws muaj ob txheej txheej hlau.

2µin (0.05µm) – 5µin (0.125µm) ntawm kub tshaj 120µin (3µm) – 240µin (6µm) ntawm Nickel

Zoo heev solderability;Cov ntaub qhwv yog tiaj thiab sib xws;Al hlau bendability;Tsawg tiv thaiv;Lub neej txee ntev;Zoo corrosion kuj thiab durability

"Dub Pad" kev txhawj xeeb;Teeb liab poob rau kev siv teeb liab kev ncaj ncees;tsis tuaj yeem rov ua haujlwm dua

Zoo heev rau kev sib dhos ntawm lub suab zoo thiab qhov chaw mount qhov chaw (BGA, QFP ...);Zoo heev rau ntau hom Soldering;Zoo dua rau PTH, nias haum;Hlau Bondable;Pom zoo rau PCB nrog daim ntawv thov kev ntseeg siab xws li aerospace, tub rog, kev kho mob thiab cov neeg siv khoom siab, thiab lwm yam;Tsis pom zoo rau Touch Contact Pads.

Electrolytic Ni/Au (Mos kub)

99.99% ntshiab - 24 carat Kub siv tshaj nickel txheej los ntawm cov txheej txheem electrolytic ua ntej soldermask.

99.99% Pure kub, 24 Karat 30µin (0.8µm) -50µin (1.3µm) tshaj 100µin (2.5µm) -200µin (5µm) ntawm Nickel

Hard, ruaj nto;Zoo conductivity;Flatness;Al hlau bendability;Tsawg tiv thaiv;Lub neej ntev

kim;Au embrittlement yog tuab heev;layout txwv;Kev ua haujlwm ntxiv / kev ua haujlwm hnyav;Tsis haum rau soldering;Txheej tsis sib xws

Feem ntau yog siv hauv hlau (Al & Au) kev sib txuas hauv cov pob khoom xws li COB (Chip on Board)

Electrolytic Ni/Au (Hard kub)

98% ntshiab - 23 carat Kub nrog hardeners ntxiv rau lub plating da dej thov tshaj nickel txheej los ntawm cov txheej txheem electrolytic.

98% Ntshiab kub, 23 Karat30µm (0.8µm) -50µin (1.3µm) tshaj 100µin (2.5µm) -150µin (4µm) Nickel

Zoo heev solderability;Cov ntaub qhwv yog tiaj thiab sib xws;Al hlau bendability;Tsawg tiv thaiv;Reworkable

Tarnish (kev tuav & cia) corrosion nyob rau hauv siab sulfur ib puag ncig;Txo cov kev xaiv saw hlau los txhawb qhov kev ua tiav no;Lub qhov rais ua haujlwm luv ntawm cov theem sib dhos.

Feem ntau yog siv rau kev sib txuas hluav taws xob xws li ntug txuas (kub ntiv tes), IC cab kuj boards (PBGA / FCBGA / FCCSP ...), Keyboards, roj teeb hu thiab qee qhov ntsuas ntsuas, thiab lwm yam.

Immersion Ag

Ib txheej nyiaj yog tso rau ntawm tooj liab los ntawm cov txheej txheem electroless tom qab etch tab sis ua ntej soldermask

5µin (0.12µm) -20µin (0.5µm)

Zoo heev solderability;Cov ntaub qhwv yog tiaj thiab sib xws;Al hlau bendability;Tsawg tiv thaiv;Reworkable

Tarnish (kev tuav & cia) corrosion nyob rau hauv siab sulfur ib puag ncig;Txo cov kev xaiv saw hlau los txhawb qhov kev ua tiav no;Lub qhov rais ua haujlwm luv ntawm cov theem sib dhos.

Kev lag luam hloov pauv rau ENIG rau Fine Traces thiab BGA;Zoo tagnrho rau kev kub ceev teeb liab daim ntawv thov;Zoo rau kev hloov pauv membrane, EMI shielding, thiab txhuas hlau txuas;Haum rau nias haum.

Immersion Sn

Nyob rau hauv ib tug electroless tshuaj da dej, ib tug dawb nyias txheej ntawm Tin deposits ncaj qha rau tooj liab ntawm Circuit Court boards raws li ib tug barrier kom tsis txhob oxidation.

25μm (0.7μm) - 60μm (1.5μm)

Qhov zoo tshaj plaws rau xovxwm haum tshuab;Nqi-zoo;Planar;Zoo heev solderability (thaum tshiab) thiab kev ntseeg tau;Flatness

Solderability degradation nrog siab temps & cycles;Exposed tin ntawm lub rooj sib txoos zaum kawg tuaj yeem corrode;Kev daws teeb meem;Tin Wiskering;Tsis haum rau PTH;Muaj Thiourea, lub npe hu ua Carcinogen.

Pom zoo rau ntau qhov ntau lawm;Zoo rau SMD qhov chaw, BGA;Qhov zoo tshaj plaws rau xovxwm haum thiab backplanes;Tsis pom zoo rau PTH, tiv tauj cov keyboards, thiab siv nrog lub qhov ncauj qhov ntswg

Table2 Kev ntsuam xyuas ntawm cov khoom siv niaj hnub PCB Surface Finishes ntawm kev tsim khoom thiab kev siv

Kev tsim cov khoom siv feem ntau siv nto tiav

Cov khoom

ENIG

ENEPIG

Mos Kub

Hard kub

IAg

ISn

HASL

HASL- LF

OSP

Nrov nrov

Siab

Tsawg

Tsawg

Tsawg

Nruab nrab

Tsawg

Tsawg

Siab

Nruab nrab

Tus nqi txheej txheem

Siab (1.3x)

Siab (2.5x)

Siab tshaj (3.5x)

Siab tshaj (3.5x)

Nruab nrab (1.1x)

Nruab nrab (1.1x)

Tsawg (1.0x)

Tsawg (1.0x)

qis tshaj (0.8x)

Tso nyiaj

Kev nqhis dej

Kev nqhis dej

Hluav taws xob

Hluav taws xob

Kev nqhis dej

Kev nqhis dej

Kev nqhis dej

Kev nqhis dej

Kev nqhis dej

Txee lub neej

Ntev

Ntev

Ntev

Ntev

Nruab nrab

Nruab nrab

Ntev

Ntev

Luv luv

Raws li RoHS

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

No

Yog lawm

Yog lawm

Surface Co-planarity rau SMT

Zoo heev

Zoo heev

Zoo heev

Zoo heev

Zoo heev

Zoo heev

pluag

Zoo

Zoo heev

Tooj liab

No

No

No

Yog lawm

No

No

No

No

Yog lawm

tuav

Ib txwm

Ib txwm

Ib txwm

Ib txwm

Tseem ceeb

Tseem ceeb

Ib txwm

Ib txwm

Tseem ceeb

Txheej Txheem Ua Haujlwm

Nruab nrab

Nruab nrab

Siab

Siab

Nruab nrab

Nruab nrab

Nruab nrab

Nruab nrab

Tsawg

Rework Peev xwm

No

No

No

No

Yog lawm

Tsis pom zoo

Yog lawm

Yog lawm

Yog lawm

Yuav tsum tau Thermal Cycles

ntau

ntau

ntau

ntau

ntau

2-3

ntau

ntau

2

Whisker qhov teeb meem

No

No

No

No

No

Yog lawm

No

No

No

Thermal Shock (PCB MFG)

Tsawg

Tsawg

Tsawg

Tsawg

Tsawg heev

Tsawg heev

Siab

Siab

Tsawg heev

Tsawg Resistance / Siab ceev

No

No

No

No

Yog lawm

No

No

No

N/A

Daim ntawv thov ntawm feem ntau siv nto finishes

Daim ntawv thov

ENIG

ENEPIG

Mos Kub

Hard kub

IAg

ISn

HASL

LF-HASL

OSP

Riam

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Flex

Txwv tsis pub

Txwv tsis pub

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Flex-Rigid

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Tsis nyiam

Pitch zoo

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Tsis nyiam

Tsis nyiam

Yog lawm

BGA & μBGA

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Tsis nyiam

Tsis nyiam

Yog lawm

Ntau Solderability

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Txwv tsis pub

Flip Chip

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

No

No

Yog lawm

Nias Fit

Txwv tsis pub

Txwv tsis pub

Txwv tsis pub

Txwv tsis pub

Yog lawm

Zoo heev

Yog lawm

Yog lawm

Txwv tsis pub

Dhau-Qhov

Yog lawm

Yog lawm

Yog lawm

Yog lawm

Yog lawm

No

No

No

No

Hlau Bonding

Yog (Al)

Yog (Al, Au)

Yog (Al, Au)

Yog (Al)

Hloov pauv (Al)

No

No

No

Yog (Al)

Solder Wettability

Zoo

Zoo

Zoo

Zoo

Zoo heev

Zoo

pluag

pluag

Zoo

Solder Joint Integrity

Zoo

Zoo

pluag

pluag

Zoo heev

Zoo

Zoo

Zoo

Zoo

Lub txee lub neej yog qhov tseem ceeb uas koj yuav tsum xav txog thaum ua koj cov sijhawm tsim khoom.Txee lub neejyog lub qhov rais ua haujlwm uas tso cai rau kev ua tiav kom tiav PCB weldability.Nws yog ib qho tseem ceeb kom paub tseeb tias tag nrho koj cov PCBs tau sib sau ua ke hauv lub txee lub neej.Ntxiv nrog rau cov khoom siv thiab cov txheej txheem uas ua rau saum npoo tiav, txee lub neej ntawm kev ua tiav yog muaj zog cuam tshuamlos ntawm PCBs ntim thiab cia.Tus neeg thov nruj me ntsis ntawm txoj cai cia txoj kev qhia los ntawm IPC-1601 cov txheej txheem yuav khaws cov khoom tiav 'weldability thiab kev ntseeg tau.

Table3 Txee lub neej Kev sib piv ntawm Cov Nto Nto Ua tiav ntawm PCB

 

Hom SHEL LIFE

Tswvyim Txee Lub Neej

Rework Chance

HASL-LF

12 Lub Hlis

12 Lub Hlis

YOG

OSP

3 Lub Hlis

1 Lub Hlis

YOG

ENIG

12 Lub Hlis

6 hli

TSIS MUAJ*

ENEPIG

6 hli

6 hli

TSIS MUAJ*

Electrolytic Ni/Au

12 Lub Hlis

12 Lub Hlis

NO

IAg

6 hli

3 Lub Hlis

YOG

ISn

6 hli

3 Lub Hlis

YOG **

* Rau ENIG thiab ENEPIG ua tiav lub voj voog rov ua haujlwm los txhim kho qhov chaw ntub dej thiab txee lub neej muaj.

** Chemical Tin rework tsis pom zoo.

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Post lub sij hawm: Nov-16-2022

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